Publication Date: 2023/08/02
Abstract: Printed Circuit Boards (PCBs) have become integral to modern electronics. With the increasing demand for high-speed digital/Analog/RF Circuits, the need for PCBs with high-speed materials has grown significantly. High-speed materials have become necessary for PCBs in commercial, data centers, telecommunication, and aerospace applications. This article will discuss the basics of the high-speed materials selection process, its properties, the Lamination process, and the materials used in PCBs. PCBs are an essential component of electronic devices, and performance and reliability depend on the materials used in their construction. The PCB material selection process involves comprehensively understanding various materials and their properties. This article will explore the steps involved in the PCB material selection process.
Keywords: PCB Fabrication, PCB lamination Process, Glass fabric, Flex PCB, Glass Weave Skew, Single Ply-Dual Ply, Dielectric Constant (dk), Coefficient of Thermal Expansion (CTE).
DOI: https://doi.org/10.5281/zenodo.8208176
PDF: https://ijirst.demo4.arinfotech.co/assets/upload/files/IJISRT23JUN1546.pdf
REFERENCES